DocumentCode
3516809
Title
Electrical property of conductive adhesives using silver-coated copper filler
Author
Nishikawa, Hisashi ; Mikami, Saya ; Terada, Nobuto ; Miyake, Koich ; Aoki, Akira ; Takemoto, Tadashi
Author_Institution
Joining & Welding Res. Inst., Osaka Univ., Osaka
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
825
Lastpage
828
Abstract
As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, isotropic conductive adhesives (ICAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, the silver was coated with copper filler, and the silver-coated copper was tested as a filler metal. As a result, it was found that the electrical resistance of ICA with silver-coated copper filler was clearly lower and more stable than that of ICA with copper filler after curing and after reliability tests.
Keywords
adhesives; copper; curing; electrical resistivity; reliability; silver; Ag-Cu; conductive adhesives; curing; electrical property; electrical resistance; oxidation; reliability; silver-coated copper filler; Conductive adhesives; Conductivity; Copper; Costs; Filler metals; Independent component analysis; Oxidation; Silver; Stability; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684458
Filename
4684458
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