DocumentCode
3517052
Title
Structure property correlation of epoxy resins under the influence of moisture and temperature; and comparison of diffusion coefficient with MD-simulations
Author
Dermitzaki, E. ; Wunderle, B. ; Bauer, J. ; Walter, H. ; Michel, B.
Author_Institution
MicroMaterials Center Berlin, Fraunhofer Inst. of Reliability & Microintegration, Berlin
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
897
Lastpage
902
Abstract
We made a structure property correlation (SPC) by altering systematically the chemistry of a cross-linked epoxy resin and examining the material behaviour and failure mechanisms under the external influence of moisture, temperature and stress. The epoxy resin (aromatic epoxy: 1,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) was examined under different loading conditions (65degC/75rh, 85degC/85rh & 98degC/100rh). The stoichiometry (2/1 and 4/3) was changed and in parallel the molecular weight of the hardener was increased (2, 4 and 6 carbons), thus ending with 6 materials. Under these conditions we made gravimetric measurements to obtain the diffusion coefficient (D) and the maximum water concentration (Csat), which was input data for the Molecular Dynamic (MD) simulations. As representative structure for the simulation we introduce the so called pseudo-cut model: partly reacted hardeners and epoxy resins representing the polarity of the system as if it was fully reacted. The result showed the dependency of the diffusion coefficient on the crosslinks. For thermomechanical characterization we performed (Storage Modulus E´, Glass Transition Temperature Tg and Coefficient of Thermal Expansion-alpha). The expected tendency was followed in all the experiments, which showed dependency on structure and water concentration.
Keywords
density measurement; diffusion; failure (mechanical); molecular dynamics method; molecular weight; polymers; stoichiometry; thermomechanical treatment; water; 1,2-diaminoethan; 1,3-bis-(2,3-epoxypropyl)-benzene; amine hardener; diffusion coefficient; epoxy resins; failure mechanisms; gravimetric measurements; molecular dynamic simulations; molecular weight; pseudocut model; stoichiometry; structure property correlation; thermomechanical characterization; water concentration; Chemistry; Epoxy resins; Failure analysis; Glass; Mechanical factors; Moisture; Organic materials; Stress; Temperature; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684471
Filename
4684471
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