DocumentCode :
3517086
Title :
Room temperature sintering mechanism of Ag nanoparticle paste
Author :
Wakuda, D. ; Chang-Jae Kim ; Kim, Chang-Jae ; Suganuma, Katsuaki
Author_Institution :
Dept. of Adaptive Machine Syst., Osaka Univ., Suita
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
909
Lastpage :
914
Abstract :
Recently, the authors have developed a novel room temperature wiring method with Ag nanoparticle paste. In the present work, the sintering mechanism of Ag nanoparticle paste was clarified through analysis of the adsorption stability and the removal of the dispersant from the Ag nanoparticles. The Ag nanoparticles in the paste are protected by dodecylamine as a dispersant. This paste possesses a substantially long shelf life. When a printed line of Ag nanoparticle paste is dipped in a methanol bath, the methanol dissolves the dispersant allowing it to be removed from the nanoparticles, effectively. Ag nanoparticles are sintered within a short period, although the sintering is not uniform. Some Ag nanoparticles grow quickly and form networks by sintering necking. The other nanoparticles remain on the nano-meter scale. Large Ag particles and Ag skeletons continue to grow by absorbing very small nanoparticles. In addition, the effect of ethanol and isopropanol as treatment agents is found.
Keywords :
adsorption; nanoparticles; nanotechnology; silver; sintering; Ag; adsorption stability; dispersant removal; ethanol; isopropanol; nanoparticle paste; sintering; temperature 293 K to 298 K; Dispersion; Glass; Mass spectroscopy; Methanol; Nanoparticles; Printing; Protection; Substrates; Temperature; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684473
Filename :
4684473
Link To Document :
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