• DocumentCode
    3517264
  • Title

    Solder bumping for flip-chips with an electro-magnetic actuator

  • Author

    Kessling, O.S. ; Irlinger, F. ; Lueth, T.C.

  • Author_Institution
    Dept. of Micro Technol. & Med. Device Technol., Tech. Univ. Munchen, Munich
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    981
  • Lastpage
    984
  • Abstract
    This paper reports an actuator for printing solder. Different types of solder can be printed: Sn63Pb37, Sn100, Sn96Ag4, and Sn97Cu3. The primary application of the print head is the field of flip-chip bumping. The advantage in this case is the flexible generation of solder balls on a circuit board without the need of using a screen printing mask.
  • Keywords
    copper alloys; electromagnetic actuators; flip-chip devices; integrated circuit interconnections; lead alloys; silver alloys; soldering; tin; tin alloys; SnAg; SnCu; SnPb; chip substrate interconnection; electro-magnetic actuator; flip-chips; print head; solder bumping; thermal stress; Coils; Glass; Head; Lead; Manufacturing; Piezoelectric actuators; Printing; Temperature; Thermal stresses; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684485
  • Filename
    4684485
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3517264