Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs

Author

Schacht, R. ; Wunderle, B. ; May, D. ; Abo Ras, M. ; Faust, W. ; Michel, B. ; Reichl, Herbert

Author_Institution

Fraunhofer Inst. Reliability & Microintegration, Berlin

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

999

Lastpage

1008

Abstract

This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models.

Keywords

crack detection; infrared imaging; multilayers; nondestructive testing; organic compounds; printed circuits; PCB; crack growths; electrical excitation; laser excitation; nondestructive tests; organic multilayer; pulse IR thermography; thermal material simulation model; thermal via-structures; Analytical models; Copper; Electronic packaging thermal management; Failure analysis; Laser excitation; Materials testing; Nondestructive testing; Optical materials; Thermal resistance; Transmission line matrix methods; 3D com-puter tomography; Thermal via; effective thermal material simulation model; laser excitation; multi layer PCB; non-destructive failure analytic method; pulse IR-thermography;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684489

Filename

4684489