DocumentCode :
3517447
Title :
Ultrasonic flaw detection using sparse representation for failure analysis of next generation microelectronic packages
Author :
Zhang, Guangming ; Harvey, David M. ; Braden, Derek R.
Author_Institution :
Gen. Eng. Res. Inst., Liverpool John Moores Univ., Liverpool
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
1045
Lastpage :
1050
Abstract :
In this paper, a sparse Bayesian learning-based ultrasonic signal processing method is designed to detect and characterize flaws in thin multilayer structures, where the reflectivity is sparse. Sparse Bayesian learning is first used to decompose an ultrasonic signal into sparse signal representations over an overcomplete dictionary that is learnt from a training data set in advance. Ultrasonic flaw detection is then carried out on the basis of the sparse signal representations. The performance of the proposed method is experimentally verified using ultrasonic traces acquired from microelectronic packages by a scanning acoustic microscope.
Keywords :
acoustic microscopy; electronics packaging; flaw detection; multilayers; ultrasonic materials testing; microelectronic packages; scanning acoustic microscope; sparse Bayesian learning-based ultrasonic signal processing method; sparse signal representations; thin multilayer structures; ultrasonic flaw detection; ultrasonic signal; ultrasonic traces; Bayesian methods; Design methodology; Failure analysis; Microelectronics; Nonhomogeneous media; Packaging; Process design; Signal design; Signal processing; Signal representations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684496
Filename :
4684496
Link To Document :
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