• DocumentCode
    3517944
  • Title

    Equipment start-up in a manufacturing environment

  • Author

    Vines, Landon ; Jhota, Ravl ; Cannizzaro, Stephen

  • Author_Institution
    VLSI Technol Inc., San Antonio, TX, USA
  • fYear
    1991
  • fDate
    20-22 May 1991
  • Firstpage
    55
  • Lastpage
    61
  • Abstract
    The authors present the methodology used to install and start up a new plasma etcher for production in a 1.0 micron/CMOS manufacturing line. It was demonstrated that a coordinated effort by equipment engineering, process engineering, technology development, equipment maintenance, and a vendor/partner can result in a quality-oriented start up. A specification was written to incorporate the procedures for installation, start up, equipment baselining, process characterization, and transfer to production on new equipment. It is noted that an ongoing relationship with a vendor/partner and all groups within the fabrication area will enable continuous improvement to the existing equipment and any new equipment being purchased
  • Keywords
    CMOS integrated circuits; integrated circuit manufacture; production control; sputter etching; 1 micron; CMOS manufacturing line; equipment baselining; equipment engineering; equipment maintenance; installation methodology; manufacturing environment; plasma etcher; process engineering; quality-oriented start up; technology development; transfer to production; Delay; Etching; Fabrication; Gases; Job shop scheduling; Manufacturing processes; Plasma applications; Production; Qualifications; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1991. ISMSS 1991., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    0-7803-0027-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1991.146266
  • Filename
    146266