Metallographic preparation of the SnAgCu solders for optical microscopy and EBSD Investigations

Author

Panchenko, Iuliana ; Mueller, Maik ; Wolter, Klaus-juergen

Author_Institution

Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany

fYear

2010

fDate

12-16 May 2010

Firstpage

18

Lastpage

23

Abstract

In order to investigate the microstructure of lead-free SnAgCu solders by optical microscopy and Electron Backscatter Diffraction it is necessary to provide a qualitative metallographic preparation. The difficulties of a preparation of these solders are connected with a high softness and presence of hard intermetallic compounds. They are discussed in this study and the appropriate recipe is proposed. The samples were manufactured of SnAg3Cu0.7 (wt. %) solder in a form of solder spheres with a diameter of 270 μm, cooled at the rate of 1.1 K/s. The metallographic preparation was carried out on a TegraSystem from Struers. The quality of the prepared samples was checked by image Orientation Imaging Microscopy softwarequality maps, created by the Orientation Imaging Microscopy software.

Keywords

copper alloys; electron backscattering; materials preparation; metallography; optical microscopy; silver alloys; solders; tin alloys; SnAgCu; SnAgCu solder metallographic preparation; Struers; TegraSystem; electron backscatter diffraction; hard intermetallic compounds; image quality maps; lead-free SnAgCu solder microstructure; optical microscopy; orientation imaging microscopy software; size 270 mum; Abrasives; Epoxy resins; Microscopy; Optical imaging; Optical microscopy; Suspensions;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2010 33rd International Spring Seminar on

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7849-1

Electronic_ISBN

978-1-4244-7850-7

Type

conf

DOI

10.1109/ISSE.2010.5547252

Filename

5547252