Title :
Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages
Author :
Gain, A.K. ; Chan, Y.C. ; Yung, K.C. ; Sharif, Ahmed ; Ali, L.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong
Abstract :
The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition of nano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn-3Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively.
Keywords :
ball grid arrays; bismuth alloys; ductile fracture; integrated circuit metallisation; integrated circuit packaging; interface structure; nickel alloys; shear strength; solders; tin alloys; zinc alloys; Au-Ni-Cu; SnZnBiNi; SnZnNi; ball grid array packages; ductile fracture surfaces; electronic packaging; interfacial microstructures; lead-free solders; nanonickel additions; pad metallization; shear loads; shear strengths; solder structure; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Lead; Mechanical factors; Nickel; Powders; Temperature;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684540
