DocumentCode :
3518145
Title :
Thick film double thermodynamic sensor system
Author :
Reznicek, Zdenek ; Szendiuch, I. ; Reznicek, M.
Author_Institution :
HIT Ltd., Nedachlebice
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
1301
Lastpage :
1304
Abstract :
This paper deals with a new family of thick film sensors used for thermodynamic monitoring and controlling of processes in industrial systems. In previous papers mentioned below the below mentioned basic principle of new thermodynamic sensor was introduced and its construction on alumina ceramic substrate was demonstrated. Generally, this sensor has plenty of application possibilities in various areas of industry sectors. Some final users especially from the RF area call for sensors that are independent from of contiguous environment effects. Such applications can be realized by using the double thermodynamic sensor probe. The basic principle of this solution is an external thermodynamic sensor that creates the thermodynamic environment shield for the internal sensor used for process monitoring inside the shielded area. Before implementation of the sensor system the simulation model of the double thermodynamic sensor as a particular element of the thermodynamic system was calculated. The values obtained from simulation (ANSYS, FLOMERICS) are compared and valuated with experimental results, and are shown in this paper. There is a good conformity between calculated and measured values. Results obtained from simulation enable construction of are used to construct a new family of double thermodynamic sensor probes in thermodynamic circuitry models, which are integrable in many industrial thermodynamic systems designed in standardized design environments (ANSYS, MATHCAD, FEMLAB etc.). They can be used as technical solutions in process and media monitoring for the controlling system integral design of any complex thermodynamics systems, namely automotive, power, heat distribution, food, chemical and petrochemical industry etc.
Keywords :
integrated circuit modelling; manufacturing processes; process monitoring; radiometers; temperature measurement; thermodynamics; thick film sensors; ANSYS simulation; FLOMERICS simulation; double thermodynamic sensor system; thermodynamic circuitry models; thick film sensors; Construction industry; Control systems; Electrical equipment industry; Industrial control; Monitoring; Probes; Sensor systems; Thermal sensors; Thermodynamics; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684542
Filename :
4684542
Link To Document :
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