Title :
Metallographic analysis of laser soldered chip resistors
Author :
Hurtony, Tamás ; Balogh, Bálint ; Pintér, Dániel ; Lénárt, Gyula
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
During the last decade laser material processing has been used in more and more fields of electronics technology. Among these techniques laser soldering processes showed great improvements and they offer several advantages mainly in terms of localized heating, rapid rise and fall in temperature, non-contact and easily automated process. This paper presents a systematic experimental investigation, which was aimed at finding relation between the most significant laser soldering parameters (soldering time and average power) and the intermetallic layer thickness and the microstructure of the solder joint. We applied defocused frequency tripled Nd:YAG laser beam on simple SMD chip resistors. The solder joints were qualified by resistance measurements, X-ray micrographs, shear tests, and the microstructure of the solder joint was analyzed with SEM on cross-section samples.
Keywords :
laser materials processing; measurement systems; metallography; resistors; scanning electron microscopy; soldering; SEM; SMD chip resistors; X-ray micrographs; YAG:Nd; automated process; average power; electronics technology; intermetallic layer thickness; laser soldered chip resistors; localized heating; metallographic analysis; microstructure; resistance measurements; shear tests; solder joint; soldering time; Laser applications; Laser beams; Microstructure; Resistors; Soldering; X-ray lasers;
Conference_Titel :
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7849-1
Electronic_ISBN :
978-1-4244-7850-7
DOI :
10.1109/ISSE.2010.5547269
