DocumentCode
3518227
Title
Package–on–Package – Review on a Promising Packaging Technology
Author
Geczy, Attila ; Illyefalvi-Vitez, Zsolt
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear
2010
fDate
12-16 May 2010
Firstpage
117
Lastpage
122
Abstract
Package-on-Package (PoP) components are BGA packages stacked on each other. With this method not only board space is saved, but signal routes are also shortened. It was presented by a cooperation of Amkor and Nokia. The vertical 3 dimensional stacking of BGA components broadens the possibilities of planar surface mounting technology. The PoP technology is constantly evolving; the latest solutions offer wide variety of bumping and stacking technologies. This paper is a review on this aspiring 3D packaging method. Preliminary soldering experiments with dummy packages are also presented.
Keywords
ball grid arrays; soldering; surface mount technology; 3D packaging method; Amkor; BGA packages; Nokia; PoP components; bumping technology; dummy packages; package-on-package components; planar surface mounting technology; preliminary soldering experiments; stacking technology; vertical 3 dimensional stacking; Copper; Inspection; Materials; Soldering; Springs; Stacking;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location
Warsaw
Print_ISBN
978-1-4244-7849-1
Electronic_ISBN
978-1-4244-7850-7
Type
conf
DOI
10.1109/ISSE.2010.5547272
Filename
5547272
Link To Document