DocumentCode :
3518230
Title :
Evidence of energetically-localized trap-states at SOI-BOX interface in high-dose SIMOX wafers
Author :
Ushiki, T. ; Kotani, K. ; Funaki, T. ; Kawai, K. ; Ohmi, T.
Author_Institution :
New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan
fYear :
1999
fDate :
4-7 Oct. 1999
Firstpage :
48
Lastpage :
49
Abstract :
As the trend in SOI technology continues to be towards thin-film devices, it is important to take a closer look at the electrically active defects at SOI-BOX interface, which could strongly affect the performance and reliability of SOI devices (Cristoloveanu, 1995). Although several studies on the interface trap densities at the SOI-BOX interface of SIMOX wafers have been reported (Nakashima et al, 1998; Yang et al., 1992), comprehensive analysis of these electrically active defects has not yet been fully studied, despite its scientific interest and technological importance. The purpose of this paper is to show for the first time that extraordinary kink effects have been experimentally observed in back-gate transconductance (g/sub m2/) characteristics of fully-depleted (FD) SOI MOS transistors on high-dose SIMOX wafers, and a physical explanation has been found.
Keywords :
MOSFET; SIMOX; buried layers; dielectric thin films; doping profiles; electron traps; hole traps; interface states; semiconductor device measurement; semiconductor device models; SIMOX wafers; SOI device performance; SOI device reliability; SOI technology; SOI-BOX interface; Si-SiO/sub 2/; back-gate transconductance; electrically active defects; energetically-localized trap-states; fully-depleted SOI MOS transistors; high-dose SIMOX wafers; interface trap density; kink effects; thin-film devices; Electron traps; Equations; Implants; Iron; MOS devices; MOSFETs; Semiconductor device modeling; Thin film devices; Transconductance; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1999. Proceedings. 1999 IEEE International
Conference_Location :
Rohnert Park, CA, USA
ISSN :
1078-621X
Print_ISBN :
0-7803-5456-7
Type :
conf
DOI :
10.1109/SOI.1999.819852
Filename :
819852
Link To Document :
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