• DocumentCode
    3518383
  • Title

    Gaining competitive advantage through continuous improvement programs

  • Author

    Herrera, Richard ; Miller, Alan

  • Author_Institution
    Lam Res. Corp., Fremont, CA, USA
  • fYear
    1991
  • fDate
    20-22 May 1991
  • Firstpage
    69
  • Lastpage
    74
  • Abstract
    The authors describe a unique use of statistical quality control (SQC) and statistical process control (SPC) techniques in a total quality management program designed to improve reliability and process capability in plasma etch systems. Although in this study an equipment manufacturing process is observed, this program paves the way for continuous improvement gains in all manufacturing cycles. The continuous improvement program is first introduced. It is then shown with reference to three case studies how definition and measurement of processes and the implementation of a six-step improvement plan have yielded positive results. Besides reduction in component failure rates, defects per unit, and machine-to-machine variation, the authors found that it was possible to make accountability a way of life, increase the warranty period for equipment, and reduce cycle time in the manufacturing area
  • Keywords
    integrated circuit manufacture; production control; quality control; sputter etching; statistical process control; competitive advantage; component failure rates; continuous improvement programs; defects per unit; equipment manufacturing process; machine-to-machine variation; plasma etch systems; process capability; reliability; statistical process control; statistical quality control; total quality management program; Continuous improvement; Etching; Manufacturing processes; Plasma applications; Plasma materials processing; Plasma measurements; Process control; Quality control; Total quality management; Warranties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1991. ISMSS 1991., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    0-7803-0027-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1991.146268
  • Filename
    146268