DocumentCode
3518425
Title
Dendrite material identification method using fractal analysis
Author
Dominkovics, Cs ; Harsányi, G.
Author_Institution
Product Dev., EPCOS Kft., Szombathely, Hungary
fYear
2010
fDate
12-16 May 2010
Firstpage
200
Lastpage
203
Abstract
In this study an alternative way has been investigated in order to make the identification of dendrites caused failures easier. Dendrites grown during electrochemical migration (ECM) can cause shortages which can lead to catastrophic failures. ECM is a simple transport process, it can be described with electrochemical principles. Dendrites are metal or metal-oxide structures which grow from the cathode electrode towards the anode electrode. Furthermore dendrites are natural fractal phenomena. On the other hand, dendrites as fractal objects have differently defined dimension values. The so called box dimension is widely applied to characterize the structure of fractals. Box dimension of dendrites can be calculated with the simple box calculating algorithm and with similar procedures. One way to detect shortages is the automatic optical inspection. It is worth to examine the shape and form of these shortages. In this paper the identification of dendrites caused failures is discussed. The first step is short-detection, the second step is taking optical photomicrographs - pictures editing and the third step is calculating fractal dimensions. Fractal dimensions are material specific properties. If we know the fractal dimension of a shortage, we can determine the material which it is grown from. In view of this information we can guard against shortages for example with special coatings or new printed wiring board (PWB) layout design.
Keywords
dendrites; fractals; automatic optical inspection; box dimension; catastrophic failures; dendrite material identification method; dimension values; electrochemical migration; fractal analysis; fractal dimensions; fractal objects; fractal structure; natural fractal phenomena; optical photomicrographs; pictures editing; printed wiring board layout design; short-detection; simple box calculating algorithm; special coatings; Fractals; Libraries; Materials; Pixel; Silver; Software;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location
Warsaw
Print_ISBN
978-1-4244-7849-1
Electronic_ISBN
978-1-4244-7850-7
Type
conf
DOI
10.1109/ISSE.2010.5547287
Filename
5547287
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