Electroless plating of copper nano-coned array for high reliability packaging

Nano-coned array of Cu were prepared by electroless plating with special crystallization conditioning agent. The morphologies of nano-coned array were observed by FE-SEM. The influences of active time in PdCl₂, concentration of NiSO₄middot6H₂O, crystallization conditioning agent, pH and temperature of plating solution were discussed. Then, the possible reasons of the influence on the growth of nano-coned array were investigated. NiSO₄middot6H₂O was proved as catalytic active agent. The optimum preparation conditions were fixed. The crystal crystallographic orientation and elements of the nano-coned array were measured using TEM and EDX. The nano-cones consist of 95.57% copper and 4.43% nickel. The crystal crystallographic orientation of them is typical copper FCC single crystal.