DocumentCode :
3518570
Title :
Short courses
fYear :
2008
fDate :
1-4 Sept. 2008
Abstract :
Provides an abstract for each of the presentations and a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings.
Keywords :
Assembly; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Conductive adhesives; Design engineering; Engineering management; Integrated circuit modeling; Integrated circuit packaging; Reliability engineering; USA Councils;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Type :
conf
DOI :
10.1109/ESTC.2008.4684568
Filename :
4684568
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3518570
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