Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate

Author

Tsao, L.C. ; Chang, S.Y. ; Sun, W.H. ; Yen, S.F.

Author_Institution

Dept. of Mater. Eng., Pingtung Univ. of Sci. & Technol., Pingtung, Taiwan

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

886

Lastpage

889

Abstract

Interfacial reactions between Sn3.5Ag0.5Cu lead-free solders (SAC) and Cu were investigated during soldering reactions between liquid SAC and Cu substrate at 250, 260, 275, 300 and 325degC for various reaction times. Experimental results show that a scallop-shaped layer of Cu₆Sn₅ intermetallic compounds formed during the soldering. Kinetics analysis shows that the growth of such interfacial Cu₆Sn₅ intermetallic compounds is diffusion controlled with an activation energy of 65.69 kJ/mol. This interesting behavior of IMC dissolution is attributed to the relatively high solubility of Cu in liquid solders.

Keywords

chemical interdiffusion; copper alloys; dissolving; reaction kinetics; silver alloys; soldering; solders; surface chemistry; tin alloys; Cu; Cu₆Sn₅; IMC dissolution; SnAgCu; activation energy; diffusion controlled compounds; interfacial reactions; intermetallic compounds; kinetics analysis; lead-free solders; liquid solders; scallop-shaped layer; soldering reactions; solubility; temperature 250 C; temperature 260 C; temperature 275 C; temperature 300 C; temperature 325 C; Copper alloys; Environmentally friendly manufacturing techniques; Furnaces; Intermetallic; Kinetic theory; Land surface temperature; Lead; Materials science and technology; Scanning electron microscopy; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270549

Filename

5270549