Economic reliability test methods of new soldering materials

According to RoHS directive, many new electronic products are manufactured by using of new technology and lead-free soldering materials. For reduction of the risks concerning quality and reliability of such products are necessary accurate investigations. Reliability tests of electronic interconnections are time consuming and expensive. In Reliability Laboratory of Warsaw University of Technology (WUT) are studied different test methods and optimal method, applicable by small producers of electronic equipment, is searched. In this paper are presented last results of mechanical shearing test method and compared with applied before thermal cycling and mechanical flexion methods. The application area of each method is discussed. These results show that the test time and costs can be drastically reduced by application of mechanical methods. The goal of performed research is preparation of the proposal for standardization.