Title :
Effect of PIII on the adhesion behavior of epoxy molding compound-nickel interface
Author :
Liu, Lilong ; Lu, Qian ; Wang, Yipeng ; Dai, Weifeng ; Zhang, Xin ; Li, Yuesheng ; Wu, Xiaojing
Author_Institution :
Dept. of Mater. Sci., Fudan Univ., Shanghai, China
Abstract :
The Cu leadframes pre-plated with nickel-coating were implanted with oxygen ion or nitrogen ion by Plasma Immersion Ion Implantation (PIII) technique. The contact angle measurement showed that ion-implantation lead to an obvious change of wettability. The chemical situation of the leadframe surfaces was analyzed by X-ray Photoelectron Spectroscopy (XPS), while the morphology of the leadframes was observed by scanning electron microscope (SEM). A pull-test was employed to examine the influences of ion-implantation on adhesion between the leadframe surface and molding compound.
Keywords :
X-ray photoelectron spectra; adhesion; copper alloys; electronics packaging; moulding; nickel alloys; nitrogen; oxygen; plasma immersion ion implantation; scanning electron microscopy; wetting; CuNi:N; CuNi:O; X-ray photoelectron spectroscopy; contact angle measurement; epoxy molding compound-nickel interface adhesion; leadframe morphology; leadframe surface-molding compound adhesion; plasma immersion ion implantation; scanning electron microscope; wettability; Adhesives; Chemical analysis; Goniometers; Nitrogen; Photoelectron microscopy; Plasma immersion ion implantation; Plasma measurements; Scanning electron microscopy; Spectroscopy; Surface morphology;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270562
