DocumentCode
3518975
Title
Analysis the performance of the micro-channels cooler with different inlet position
Author
Wang, Xiaojing ; Zhang, Wen ; Liu, Hongjun ; Chen, Ling ; Li, Zongshuo
Author_Institution
Shanghai Univ., Shanghai, China
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
1009
Lastpage
1013
Abstract
Electronic chips are now working at higher temperatures than they were before. It is impossible for electronic products to achieve 100% efficiency, the problems about heat manage is becoming more and more. Many experiments were performed to explore the benefits of micro-channel cooling. In the published experiments, the location of the fluid entrance are different. In order to analyze the effect of the inlet position on the performance of the micro cooler, in this paper, different inlet (outlet) position MCHS models, different distance between the inlet surface and the near ends of fins MCHS models and different inlet shape MCHS models are compared. The simulation model is established to analyze the heat distributing and highest temperature of the MCHS. The total heat flux amount is 250 W/cm2. Water is chosen as the coolant and the velocity ranges from 0.1 m/s to 5 m/s. The results show that the highest temperature in z-axis direction inlet is much lower than other two positions, so that it is the best inlet and outlet position for temperature drop, where the entrance position is perpendicular to the direction of flow in the channels. The distance between the inlet and the end of fins has effect on the performance of the micro-channel cooler. The rectangular and circular inlet has nearly the same effect on the heat dissipation, but the inlet area is much important. The simulation results play an important role for the design of micro-channels cooler.
Keywords
coolants; cooling; microchannel flow; circular inlet; coolant; heat dissipation; inlet position; microchannels cooler; Circuits; Coolants; Electronics cooling; Heat sinks; Heat transfer; Performance analysis; Response surface methodology; Shape; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270574
Filename
5270574
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