Title :
Effect of Zn addition on microstructure of Sn-Bi joint
Author :
Zhu, Q.S. ; Song, H.Y. ; Liu, H.Y. ; Wang, Z.G. ; Shang, J.K.
Author_Institution :
Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang, China
Abstract :
Zn was added into Sn-Bi solder to investigate the effect of Zn on the microstructure of the alloy. Zn addition was found to refine and redistribute the Bi-rich phase. With Zn addition, a different intermetallic compound, Cu5Zn8 was formed at the Sn-Bi-Zn/Cu interface upon reflow. After aging, the Bi segregation was not observed at the Sn-Bi-Zn/Cu interface while a continuous Bi segregation layer appeared in the Sn-Bi/Cu interface. The Zn addition into the solder freed Sn near the interface from interfacial reaction, which suppressed the occurrence of Bi segregation layer.
Keywords :
ageing; alloying additions; bismuth alloys; copper alloys; segregation; solders; tin alloys; zinc compounds; SnBiZn-Cu; aging; intermetallic compound; joint; microstructure; segregation; zinc addition; Aging; Bismuth; Electronic packaging thermal management; Intermetallic; Microstructure; Scanning electron microscopy; Soldering; Temperature sensors; Tin; Zinc;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270582
