The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive

In this work, ACA was prepared by mixing micro-sized spherical Ag particles into thermo-set epoxy resin, and RFID flip chips were assembled on the Al/PET antennae through hot-press process. The effect of bonding parameters, such as the curing degree, the curing rate and the temperature combination of down and up hot-press heads on the contact resistance and shear strength of ACA bonding joints for flexible RFID application were studied. And the reliability test (high-temperature and humidity test, 85degC, 85% relative humidity, 288 hrs) was also used to investigate the reliability of RFID tag inlays. It was found that these bonding parameters had great effect on the mechanical and electrical performance of bonding joints. For this ACA prepared here, the optimum bonding parameters for flexible RFID tag inlays was that: the curing degree is 85%, the curing rate is 15s / 170degC, and the temperature of down and up hot-press heads are 180degC/160degC.