Title :
Influencing factors and solutions for ball short during wire bonding
Author :
Meng, Zhong ; Feng, Yusheng ; Lee, Sunggug
Author_Institution :
Samsung Electron. (Suzhou) Semicond. Co., Ltd., Suzhou, China
Abstract :
During cold season (from November to April), ball short failure caused by ball deformation often occurred and pad corrosion during PCT is also detected simultaneously, so it is urgent to find root cause and assure wire bond quality. The paper reveals that ball deformation and pad corrosion are mainly caused by S and Cl in atmosphere composition. The solution of adding chemical filter is presented and a mini-environment is setup to confirm efficiency, finally ball deformation and PCT failures are eliminated.
Keywords :
chlorine; corrosion; deformation; failure analysis; lead bonding; sulphur; Cl; PCT failure elimination; S; airborne acidity molecule; atmosphere composition; ball deformation; ball short failure; chemical filter; pad corrosion; pressure cooker test; wire bonding quality; Bonding processes; Contamination; Corrosion; Electronic equipment testing; Electronics packaging; Gas detectors; Humidity; Materials testing; Scanning electron microscopy; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270588
