Title :
Research of structural factors effects on drop reliability
Author :
Wang, Jianhui ; Fu, Xingming ; Xie, Xiaoqiang ; Zhou, Jianwei ; Wang, Qian ; Lee, Zaisung
Author_Institution :
Samsung Semicond. (China) R&D CO., Ltd., Suzhou, China
Abstract :
This paper discusses the effects of chip size, PCB thickness, fixture tightness, via information on the board level drop impact performance of common IC package for hand held electronic product applications namely FBGA, when subjected to the JESD22-B111 test methodology. The experiment results reveal significant difference in the reliability performance between different via information and different PCB thickness. In addition, simulation work using input G method was performed and verified experimentally and the results are coincided with experiment results.
Keywords :
ball grid arrays; integrated circuit packaging; integrated circuit reliability; printed circuits; FBGA; IC package; JESD22-B111 test method; PCB thickness; chip size; drop impact reliability; hand held electronic product applications; input G method; Application specific integrated circuits; Assembly; Electronics industry; Fasteners; Fixtures; Packaging; Research and development; Semiconductor device reliability; Stress; Testing;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270591
