Research of structural factors effects on drop reliability

Author

Wang, Jianhui ; Fu, Xingming ; Xie, Xiaoqiang ; Zhou, Jianwei ; Wang, Qian ; Lee, Zaisung

Author_Institution

Samsung Semicond. (China) R&D CO., Ltd., Suzhou, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

1088

Lastpage

1093

Abstract

This paper discusses the effects of chip size, PCB thickness, fixture tightness, via information on the board level drop impact performance of common IC package for hand held electronic product applications namely FBGA, when subjected to the JESD22-B111 test methodology. The experiment results reveal significant difference in the reliability performance between different via information and different PCB thickness. In addition, simulation work using input G method was performed and verified experimentally and the results are coincided with experiment results.

Keywords

ball grid arrays; integrated circuit packaging; integrated circuit reliability; printed circuits; FBGA; IC package; JESD22-B111 test method; PCB thickness; chip size; drop impact reliability; hand held electronic product applications; input G method; Application specific integrated circuits; Assembly; Electronics industry; Fasteners; Fixtures; Packaging; Research and development; Semiconductor device reliability; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270591

Filename

5270591