Towards an interactive knowledge transfer – The non–destructive evaluation knowledge–based system

The “Center for Non-Destructive Nano Evaluation of Electronics Packaging” (nanoeva^®), a common organization of the Fraunhofer Institute for Non-Destructive Testing, Dresden branch (IZFP-D) and the Electronics Packaging Lab (IAVT) with its Centre for Microtechnical Manufacturing (ZμP) of the Dresden University of Technology, focuses its activities in development and application of new non-destructive evaluation (NDE) techniques jointly with the electronics industry and in transfer the knowledge to colleagues in industry and research institutes. The actual broad variety of the available techniques like x-ray diagnostics, ultrasonic microscopy, atomic force acoustic microscopy, scanning electron microscopy, optical inspection techniques, geometric laser measurement, surface characterization etc. bases on the collaboration and knowledge transfer between various scientific specialists. To advance the value of interactive knowledge transfer, nanoeva^® decided to build-up the infrastructure for the implementation of a sustainable storage and access to a consolidated NDE knowledge-based system as an additional pillar within the competence center.