• DocumentCode
    3519521
  • Title

    Influence of meso–scale analysis parameters of cross–linked polymers on final simulation results

  • Author

    Tesarski, Sebastian J. ; Holck, Ole ; Platek, Bartosz T. ; Wymyslowski, Artur

  • Author_Institution
    Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
  • fYear
    2010
  • fDate
    12-16 May 2010
  • Firstpage
    408
  • Lastpage
    411
  • Abstract
    Molecular modeling is one of the fastest developing branch of material science. There are a couple of reasons of such a state: on one hand molecular modeling tools are nowadays quite easy to implement to selected problems and on the other hand experimental research and analysis might be impossible to made or too expensive in comparison to numerical modeling as an alternative. Anyway there is a question of accuracy but in some cases we are not so much interested in precise numbers but an estimation of a proper trend would be sufficient. Literature study shows that results achieved by application of advanced numerical modeling tools fulfills convergence criteria and fits quite well to experimental data. Recently some researchers concentrate on molecular mesoscale modeling of crosslink polymers. Preliminary study shows need for an investigation of dependency of simulation parameters (time length, time step, force field type, size of a bead ect.) for final results. It is a key for good estimation of Tg and CTE of polymers. Results of simulation help to optimize the performance of polymers materials in electronics technology Mesoscale results were compared with molecular modeling simulations. The results are promising.
  • Keywords
    polymer structure; polymers; thermal expansion; coefficient of thermal expansion; cross-linked polymers; force field type; mesoscale analysis; molecular mesoscale modeling; simulation parameters; time length; time step; Analytical models; Computational modeling; Data models; Numerical models; Plastics; Resins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4244-7849-1
  • Electronic_ISBN
    978-1-4244-7850-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2010.5547359
  • Filename
    5547359