3D integration of image sensor SiP using TSV silicon interposer

Author

Wolf, M. Juergen ; Zoschke, K. ; Klumpp, A. ; Wieland, R. ; Klein, M. ; Nebrich, L. ; Heinig, A. ; Limansyah, I. ; Weber, W. ; Ehrmann, O. ; Reichl, H.

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany

fYear

2009

fDate

9-11 Dec. 2009

Firstpage

795

Lastpage

800

Abstract

3D system integration is a fast growing field that encompasses different types of technologies. The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component availability (wafer vs. bare die) and testability. The paper discusses a specific 3D image sensor system for automotive applications. The system is based on wafer level technology using silicon interposer with through silicon vias (TSV´s), a flip chip assembled sensor element and a microcontroller. The specific system concept, the technical solution and results are discussed.

Keywords

automotive electronics; flip-chip devices; image sensors; integrated circuit interconnections; system-in-package; three-dimensional integrated circuits; 3D image sensor system; SiP; TSV silicon interposer; automotive applications; electrical performance; flip chip assembled sensor element; microcontroller; system-in-package; through silicon vias; wafer level technology; Automotive applications; Availability; Boundary conditions; Costs; Flip chip; Image sensors; Silicon; Testing; Through-silicon vias; Time to market;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Conference_Location

Singapore

Print_ISBN

978-1-4244-5099-2

Electronic_ISBN

978-1-4244-5100-5

Type

conf

DOI

10.1109/EPTC.2009.5416440

Filename

5416440