Title :
Thermal testing: fault location strategies
Author :
Altet, Josep ; Rubio, Antonio ; Schaub, E. ; Dialhaire, S. ; Claeys, W.
Author_Institution :
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
Abstract :
By measuring the temperature at some points of an IC during a test procedure, defects can be detected (fault testing). With a simple processing of the measured temperature waveform, the distance between the temperature monitoring point and the activated defect can be derived. This paper presents four temperature measuring strategies to determine this distance for diagnosis purposes
Keywords :
fault diagnosis; goniometers; integrated circuit measurement; integrated circuit testing; IC test procedure; activated defect; fault diagnosis purposes; fault location strategies; temperature measurement; temperature monitoring point; temperature waveform; thermal testing; Circuit testing; Fault location; Integrated circuit testing; Phase measurement; Remote monitoring; Silicon; Temperature measurement; Temperature sensors; Thermal resistance; Time measurement;
Conference_Titel :
VLSI Test Symposium, 2000. Proceedings. 18th IEEE
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7695-0613-5
DOI :
10.1109/VTEST.2000.843844
