Shape and fatigue life prediction of chip resistor solder joints

Author

Zheng, Guanqun ; Wang, Chunqing

Author_Institution

Shenzhen Polytech., Shenzhen, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

1167

Lastpage

1170

Abstract

In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution characteristics of the stress and strain in solder joints under thermal cycle load were analyzed. Based on this, fatigue life of solder joints with different solder volumes was predicted. Analysis results show that under thermal cycling conditions solder joints of tiny concave acquired the best mechanical properties, and the its life is the longest.

Keywords

fatigue; finite element analysis; mechanical properties; resistors; solders; 3D mechanical model; chip resistor solder joints; fatigue life prediction; finite element analysis; mechanical properties; shape prediction; solder volume; thermal cycling; tiny concave; Capacitive sensors; Fatigue; Finite element methods; Mechanical factors; Predictive models; Resistors; Shape; Soldering; Thermal loading; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270612

Filename

5270612