Title :
Shape and fatigue life prediction of chip resistor solder joints
Author :
Zheng, Guanqun ; Wang, Chunqing
Author_Institution :
Shenzhen Polytech., Shenzhen, China
Abstract :
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution characteristics of the stress and strain in solder joints under thermal cycle load were analyzed. Based on this, fatigue life of solder joints with different solder volumes was predicted. Analysis results show that under thermal cycling conditions solder joints of tiny concave acquired the best mechanical properties, and the its life is the longest.
Keywords :
fatigue; finite element analysis; mechanical properties; resistors; solders; 3D mechanical model; chip resistor solder joints; fatigue life prediction; finite element analysis; mechanical properties; shape prediction; solder volume; thermal cycling; tiny concave; Capacitive sensors; Fatigue; Finite element methods; Mechanical factors; Predictive models; Resistors; Shape; Soldering; Thermal loading; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270612
