Title :
Modeling and analysis of die-to-die vertical coupling in 3-D IC
Author :
Lee, Sangrok ; Kim, Gawon ; Kim, Jaemin ; Song, Taigon ; Lee, Junho ; Lee, Hyungdong ; Park, Kunwoo ; Kim, Joungho
Author_Institution :
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
In this paper, die-to-die vertical coupling between clock tree and spiral inductor in three-dimension (3-D) IC is analyzed, and equivalent circuit model for analysis of vertical coupling mechanism is proposed. Analysis and modeling are verified by measurement results of a designed and fabricated test vehicle. The test vehicle has two stacked dies with clock tree or a spiral inductor.
Keywords :
clocks; coupled circuits; equivalent circuits; inductors; three-dimensional integrated circuits; 3D IC; clock tree; die-to-die vertical coupling; equivalent circuit model; fabricated test vehicle; spiral inductor; Circuit analysis; Circuit testing; Clocks; Coupling circuits; Equivalent circuits; Inductors; Integrated circuit modeling; Spirals; Three-dimensional integrated circuits; Vehicles; 3D IC; S-parameter; SiP; Through-Silicon-Via (TSV); coupling; die to die; die-to-die; modeling; spiral inductor; stacking; vertical; wire bonding;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416459
