Title :
Outgassing of materials used for thin film vacuum packages
Author :
Li, Q. ; Goosen, J.F.L. ; van Beek, J.T.M. ; van Keulen, F. ; Zhang, G.Q.
Author_Institution :
Mater. innovation Inst., Delft, Netherlands
Abstract :
In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.
Keywords :
Rutherford backscattering; integrated circuit packaging; micromechanical resonators; outgassing; RBS; Rutherford backscattering spectroscopy; exodiffusion; integrated MEMS resonator; material outgassing; microelectromechanical system; thin film vacuum package; Annealing; Integrated circuit packaging; Micromechanical devices; Semiconductor device packaging; Semiconductor materials; Semiconductor thin films; Sputtering; Thermal loading; Transistors; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270637
