DocumentCode
3520162
Title
Outgassing of materials used for thin film vacuum packages
Author
Li, Q. ; Goosen, J.F.L. ; van Beek, J.T.M. ; van Keulen, F. ; Zhang, G.Q.
Author_Institution
Mater. innovation Inst., Delft, Netherlands
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
802
Lastpage
806
Abstract
In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.
Keywords
Rutherford backscattering; integrated circuit packaging; micromechanical resonators; outgassing; RBS; Rutherford backscattering spectroscopy; exodiffusion; integrated MEMS resonator; material outgassing; microelectromechanical system; thin film vacuum package; Annealing; Integrated circuit packaging; Micromechanical devices; Semiconductor device packaging; Semiconductor materials; Semiconductor thin films; Sputtering; Thermal loading; Transistors; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270637
Filename
5270637
Link To Document