Dynamic constitutive relation of EMC over a broad range of temperatures and strain rates

Author

Chen, Tong ; Niu, Xiaoyan ; Shu, Xuefeng ; Zhang, Jianwen

Author_Institution

Inst. of Appl. Mech. & Biomed. Eng., Taiyuan Univ. of Technol., Taiyuan, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

733

Lastpage

736

Abstract

In this paper, dynamic properties of EMC were studied sat different temperatures and different strain rates. Firstly EMC was investigated by quasi-static tests. Secondly a series of dynamic compressive experiments of EMC were conducted using the Split Hopkinson Pressure Bar (SHPB) at high strain rates. Corresponding measurements were conducted at temperatures ranging from 20degC to 200degC. The results indicate that the yield strength and flow stress of EMC increase remarkably with the increase of strain rate. However, the yield strength of EMC is almost unchanged with the increase of temperature which is ranging from 20degC to 200degC.

Keywords

electromagnetic compatibility; plastic flow; yield strength; EMC; dynamic constitutive relation; flow stress; quasi-static tests; split Hopkinson pressure bar; temperature 20 C to 200 C; yield strength; Bars; Biomedical measurements; Capacitive sensors; Electromagnetic compatibility; Electronic packaging thermal management; Materials testing; Plastic packaging; Semiconductor device packaging; Strain measurement; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270651

Filename

5270651