Title :
Defect in optoelectronic packaging due to phosphorus content of the underlayer coating
Author :
Hsieh, Kenny Cheng-Hsiang ; Tu, Y.K. ; Wang, Stanley C. ; Chang, H.L. ; Wang, Chingyue ; Wang, C.M. ; Liaw, J.W. ; Wang, G.I. ; Chen, C.H. ; Cheng, W.H.
Author_Institution :
Inst. of Mater. Sci. & Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
Summary form only given. This study has led to an important finding that one of the primary causes for cracks in the laser-welded Au-coated optoelectronic materials is due to the existence of the plating layer during the final stage of solidification. Therefore, it is strongly recommended that a Ni underlayer coating without P content should be used prior to the Au plating to prevent crack formation in laser-welded Au coated optoelectronic packaging.
Keywords :
gold; laser beam welding; metallic thin films; optical fabrication; optical films; optoelectronic devices; packaging; Au; Au plating; Ni; Ni underlayer coating; crack formation; laser-welded Au coated optoelectronic packaging; laser-welded Au-coated optoelectronic materials; optoelectronic packaging; phosphorus content; plating layer; solidification; underlayer coating; Coatings; Gold; Laser ablation; Optical materials; Optical pulses; Packaging; Pulsed laser deposition; Pump lasers; Space vector pulse width modulation; Substrates;
Conference_Titel :
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-339-0
DOI :
10.1109/CLEO.1998.675983
