DocumentCode :
3520586
Title :
Growth and recrystallization of electroplated copper columns
Author :
Liu, Jun ; Liu, Changqing ; Conway, Paul P. ; Zeng, Jun ; Wang, Changhai
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
fYear :
2009
fDate :
10-13 Aug. 2009
Firstpage :
695
Lastpage :
700
Abstract :
The present paper addresses the formation and evolution of microstructure and crystal structure of electroplated copper columns. Copper columns of different size have been plated on Au seed layer for a series of periods of time from half an hour to three hours and characterized by Focused Ion Beam (FIB) and XRD. It was found that not only the growth process during plating but also accompanying recrystallization and post-plating spontaneous self-annealing account for the interesting microstructure with bi-modal or tri-modal grain size distribution. The evolution of crystal structure of the copper columns during plating and self-annealing after plating was also studied and discussed. The results indicate that the presence of organic additives is not essential for self-annealing to occur in copper columns, which is against the popular belief with respect to electroplated copper films.
Keywords :
X-ray diffraction; copper; crystal structure; electroplating; focused ion beam technology; gold; grain size; recrystallisation; Au; Au seed layer; Cu; XRD; crystal structure; electroplated copper columns; focused ion beam; grain size distribution; microstructure; organic additives; recrystallization; spontaneous self-annealing; Copper; Crystal microstructure; Grain boundaries; Grain size; Industrial electronics; Manufacturing; Pulse measurements; Stress; Temperature; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
Type :
conf
DOI :
10.1109/ICEPT.2009.5270660
Filename :
5270660
Link To Document :
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