• DocumentCode
    3520622
  • Title

    Correlation between interface traps and random dopants in emerging MOSFETs

  • Author

    Chiu, Yung-Yueh ; Li, Yiming ; Cheng, Hui-Wen

  • Author_Institution
    Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    291
  • Lastpage
    294
  • Abstract
    In this work, we for the first time study the fluctuation and interaction between interface traps (ITs) and random dopants (RDs) of 16 nm MOSFETs. Totally random devices with 2D ITs at Si/high-κ oxide interface and 3D RDs inside channel are simultaneously examined using an experimentally validated 3D device simulation. Pure random ITs at Si/high-κ oxide interface will increase the threshold voltage (Vth) due to enlarge potential barrier resulting from accept-like ITs. However, the fluctuation of Vth (σVth) induced by ITs is smaller than the result of RDs. Considering the effect of ITs and RDs at the same time will result in coupled localized spikes of potential barrier and induced characteristics are much more correlated to each other which can not be estimated using adiabatic statistical sum calculation. Consequently, the effect of random ITs and RDs on device variability should be counted simultaneously for high-κ/metal gate devices.
  • Keywords
    MOSFET; aluminium compounds; elemental semiconductors; hafnium compounds; metal-insulator boundaries; semiconductor-insulator boundaries; silicon; 2D IT Si-high-K oxide interface; 3D RD inside channel; 3D device simulation; MOSFET; Si-Al2O3; Si-HfO2; adiabatic statistical sum calculation; high-κ-metal gate device; interface trap; potential barrier; random dopant; size 16 nm; threshold voltage; Fluctuations; Logic gates; Metals; Semiconductor process modeling; Silicon; Solid modeling; Three dimensional displays; 3D device simulation; effective oxide thickness; high-к/metal gate; interaction; interface trap; potential barrier; random dopant; threshold voltage fluctuation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035026
  • Filename
    6035026