DocumentCode :
3520724
Title :
Silver corrosion and whiskers growth on power contacts in industrial atmosphere of pulp and paper plants
Author :
Chudnovsky, Bella H. ; Swindler, David L. ; Thompson, John R.
Author_Institution :
Square D Co., West Chester, OH, USA
fYear :
2001
fDate :
18-22 June 2001
Firstpage :
155
Lastpage :
162
Abstract :
Extensive silver corrosion and growth of silver whiskers was found on power contacts of low voltage breakers at a recycle pulp plant in Minnesota. The phenomenon can be extremely hazardous. The plant experienced a number of failures of circuit breakers in 1999-2000 caused by strong overheating. Metallic whiskers were found growing from heavily corroded silver-plated copper surfaces of the power contacts virtually everywhere but mostly from the edges and corners. The length of the two-month old whisker reaches several inches (5-10 cm) and the thickness of the filament is up to 0.04" (/spl sim/1 mm). Using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) we have determined morphology and chemical composition of the whiskers. Most of the whiskers are made of 97-99% silver with 1-3% of copper. The surface of the larger whiskers is covered with silver sulfide. To determine the means of controlling and minimizing the hazardous phenomenon, the major factors initiating and accelerating the mechanism of whisker growths have been thoroughly investigated.
Keywords :
X-ray chemical analysis; circuit breakers; corrosion; crystal morphology; electrical contacts; paper industry; scanning electron microscopy; silver; whiskers (crystal); 1 mm; 5 to 10 cm; Ag; Minnesota; SEM; chemical composition; circuit breaker failures; energy dispersive X-ray spectroscopy; hazardous phenomenon control; hazardous phenomenon minimisation; heavily corroded silver-plated copper surfaces; hydrogen sulfide; industrial atmosphere; low voltage breakers; morphology; power contacts; pulp and paper plants; recycle pulp plant; scanning electron microscopy; silver corrosion; silver sulfide; silver whiskers growth; Circuit breakers; Copper; Corrosion; Dispersion; Low voltage; Recycling; Scanning electron microscopy; Silver; Spectroscopy; Surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Pulp and Paper Industry Technical Conference, 2001 Conference Record of.
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-6745-6
Type :
conf
DOI :
10.1109/PAPCON.2001.952963
Filename :
952963
Link To Document :
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