Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder

Author

Lee, Hwa-Teng ; Chen, Yin-Fa ; Hong, Ting-Fu ; Shih, Ku-Ta

Author_Institution

Dept. of Mech. Eng., Cheng Kung Univ., Tainan, Taiwan

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

646

Lastpage

649

Abstract

The relation between cooling rate and morphology of Ag₃Sn IMCs was investigated in this study. The morphology of Ag₃Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag₃Sn depended on cooling rate, the morphology and size of Ag₃Sn compounds were affected by cooling rate. The three types of Ag₃Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag₃Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.

Keywords

eutectic alloys; nucleation; silver alloys; solders; solidification; tin alloys; AgSn; cooling rate; eutectic alloys; intermetallic compounds; nucleation time; solidification; Aluminum; Cooling; Intermetallic; Materials science and technology; Mechanical engineering; Microstructure; Morphology; Temperature; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270669

Filename

5270669