• DocumentCode
    3520818
  • Title

    Dynamic analysis of structure of a piezoelectric MEMS micro-mirror actuator: Effects of chip anisotropy and residual stress

  • Author

    Matin, A. ; Akai, D. ; Ozaki, K. ; Kawazu, N. ; Hanebuchi, M. ; Sawada, K. ; Ishida, M.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Toyohashi, Japan
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    416
  • Lastpage
    421
  • Abstract
    This paper presents the dynamic behavior of a piezoelectric MEMS actuator using finite element simulations taking anisotropic properties of silicon chip and technologically induced stress into account. Silicon anisotropy has shown to shift eigenfrequencies particularly in higher eigenmodes compared to that of isotropic case. Technologically induced stress has resulted in substantial influence on both eigenfrequencies and eigenmodes. Eigenmodes were found to be significantly changed and shifted with such a stress state. Dynamic harmonic analysis exhibited a significant maximum vertical deflection of ~28 ¿m attainable with the actuator when excited at a resonant frequency of 112,600 Hz under 2D scanning mode.
  • Keywords
    eigenvalues and eigenfunctions; finite element analysis; internal stresses; magnetic anisotropy; microactuators; micromirrors; piezoelectric actuators; silicon; anisotropic property; chip anisotropy; dynamic behavior; dynamic harmonic analysis; eigenfrequency; eigenmode; finite element simulation; piezoelectric MEMS micromirror actuator; residual stress; silicon chip; stress state; Anisotropic magnetoresistance; Capacitive sensors; Conducting materials; Dielectric materials; Dielectric thin films; Electrodes; Ferroelectric materials; Micromechanical devices; Piezoelectric actuators; Residual stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5099-2
  • Electronic_ISBN
    978-1-4244-5100-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416510
  • Filename
    5416510