Title :
Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils
Author :
Liu, Wei ; Wang, Chunqing ; Sun, Lining ; Tian, Yanhong ; Chen, Yarong
Author_Institution :
Dept. of Electron. Packaging Technol., State Key Lab. of Adv. Welding Production Technol., China
Abstract :
Pure Sn, Sn-0.7Cu, Sn-1.5Cu and Sn-3.0Cu solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125degC for various periods. After 600 hours treatment, we found that thickness of Intermetallic Compounds (IMCs) in the pure Sn solder joints was 54mum. However, in the solder joints with Cu addition, formation of AuSn4 IMCs was inhibited, and other two kinds of Sn-Cu-Au ternary phases were found in stead. In the Sn-3.0Cu solder joints, the IMCs and phases were only 34mum in thickness, moreover, growth of the IMCs and phases did not follow the parabolic law.
Keywords :
ageing; copper alloys; gold; reflow soldering; tin alloys; Au; SnCu; interfacial reactions; intermetallic compounds; laser reflow soldering; solder joints; temperature 125 degC; time 600 hour; Aging; Electronic equipment manufacture; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Isothermal processes; Lead; Metallization; Preforms; Soldering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270672
