DocumentCode :
3520880
Title :
Temporary bonding for Chips In Wafer processing
Author :
Souriau, Jean-Charles ; Jouve, Amandine ; Sillon, Nicolas
Author_Institution :
CEA-LETI Minatec, Grenoble, France
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
412
Lastpage :
415
Abstract :
Chip In Wafer is a very challenging concept because this solution allows wafer scale processes for System in Package and a very high miniaturization and performance level. This paper describes a technologies developed for Chip integration In Wafer (CIW). The approach consists in reconstituting a wafer from heterogeneous chips embedded in a resin with the active sides coplanar. This paper present the development of a new process using wafer substrate including alignment marks and a transparence adhesive which allow an accurate dies positioning and holding during the polymer molding. The process presented in this paper is compatible for chips in polymer wafer, chips in silicon wafer, chips in glass wafer and some other frame.
Keywords :
resins; substrates; wafer bonding; active sides coplanar; glass wafer; heterogeneous chips; polymer molding; polymer wafer; silicon wafer; temporary bonding; transparence adhesive; wafer chip integration; wafer processing; wafer substrate; Chip scale packaging; Costs; Glass; Optical sensors; Polymer films; Resins; Silicon; Technological innovation; Wafer bonding; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416513
Filename :
5416513
Link To Document :
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