The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder

Author

Nadia, Aemi

Author_Institution

Mech Eng., Univ. Malaya, Kuala Lumpur, Malaysia

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

607

Lastpage

610

Abstract

Copper nano powder was incorporated into Sn-3.5Ag solder at 3wt%, by mechanically alloyed (MA) by ball milling in a planetary ball mill at room temperature. The rotation speed was kept constant at 150 rpm with different milling time, 26 hours, 78 hours and 120 hours. The milled solder was mixed with flux and reflowed at 240degC for 60 seconds. XRD result confirmed the formation of Cu₃Sn after 120 hours of milling time. The melting temperature of the samples decreased as a function of milling time. The wetting angle was improved by 48% for the composite solder Sn-3.5Ag-nano-3.0Cu for 120 hours ball milled, compared to the Sn3.5Ag solder. Increased of hardness was obtained as a result of incorporation of nanoparticle.

Keywords

X-ray diffraction; alloying additions; ball milling; composite materials; copper alloys; hardness; mechanical alloying; nanoparticles; reflow soldering; silver alloys; solders; tin alloys; wetting; SnAg-Cu; XRD; addition; composite solder; copper nanopowder; hardness; mechanically alloying; nanoparticle; planetary ball mill; reflowed solders; solder; temperature 240 degC; temperature 293 K to 298 K; time 120 h; time 26 h; time 60 s; time 78 h; wetting angle; Alloying; Ball milling; Copper; Environmentally friendly manufacturing techniques; Extraterrestrial measurements; Fabrication; Lead; Powders; Scanning electron microscopy; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270678

Filename

5270678