Growth kinetics and microstructural evolution of Cu-Sn intermetallic compounds on different Cu substrates during thermal aging

Author

Liu, Z.Q. ; Shang, P.J. ; Li, D.X. ; Shang, J.K.

Author_Institution

Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

569

Lastpage

571

Abstract

The microstructure of the eutectic SnBi/Cu interface was investigated by transmission electron microscopy (TEM). In-situ and ex-situ thermal aging were conducted to study the nucleation and growth of Cu₃Sn and Cu₆Sn₅ on both polycrystalline and single crystalline Cu substrates. The growth kinetic analysis showed that although the growth of total IMCs (Cu₃Sn + Cu₆Sn₅) was similar on single and polycrystalline Cu substrates, the Cu₃Sn grew faster on polycrystalline Cu substrate than that on single crystal Cu substrate, while Cu₆Sn₅ grew slowly on polycrystalline Cu during thermal aging.

Keywords

ageing; copper alloys; eutectic alloys; nucleation; tin alloys; transmission electron microscopy; Cu-Sn; eutectic interface; growth kinetics; intermetallic compounds; microstructural evolution; polycrystalline substrates; single crystalline substrates; thermal aging; transmission electron microscopy; Aging; Copper; Crystal microstructure; Crystallization; Intermetallic; Kinetic theory; Scanning electron microscopy; Solid state circuits; Thickness measurement; Transmission electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270685

Filename

5270685