DocumentCode
3521049
Title
Ion-implant doped large-area n-type Czochralski high-efficiency industrial solar cells
Author
Sheoran, Manav ; Emsley, Matthew ; Yuan, Min ; Ramappa, Deepak ; Sullivan, Paul
Author_Institution
Varian Semicond. Equip., Appl. Mater., Gloucester, MA, USA
fYear
2012
fDate
3-8 June 2012
Abstract
This paper discusses the design and fabrication of ion-implanted, high-efficiency, light-stable, 156 mm square, screen-printed solar cells on n-type Czochralski (Cz) silicon with full industrial processing. Doping by ion implantation provides a significant advantage over conventional furnace-based doping by providing uniform, full-area emitter and back-surface field (BSF) regions, and can eliminate four process steps over the conventional n-type cell process. Low emitter saturation current density (Joe) values of 50 fA/cm2 were achieved on boron implanted test structures passivated by an in-situ thermal oxide. Complete solar cells were fabricated with high values of short-circuit current density (Jsc), which is attributed to high lifetime of n-type base and also a superior phosphorous BSF compared to the conventional aluminum BSF (Al-BSF).
Keywords
boron; crystal growth from melt; current density; elemental semiconductors; ion implantation; semiconductor doping; silicon; solar cells; back-surface field region; boron-implanted test structures; conventional aluminum BSF; conventional furnace-based doping; conventional n-type cell process; full-area emitter; in-situ thermal oxide; industrial processing; ion-implant doped large-area high-efficiency industrial solar cells; low-emitter saturation current density values; n-type Czochralski silicon; phosphorous BSF; screen-printed solar cells; short-circuit current density; solar cell design; solar cell fabrication; Boron; Computer architecture; Ion implantation; Microprocessors; Passivation; Photovoltaic cells; Silicon; high efficiency; ion implantation; n-type;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE
Conference_Location
Austin, TX
ISSN
0160-8371
Print_ISBN
978-1-4673-0064-3
Type
conf
DOI
10.1109/PVSC.2012.6318046
Filename
6318046
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