Assessment of LF solder joint reliability by four point cyclic bending

Author

Wang, Jifan ; Ye, Yuming ; Zhao, Junying ; Liu, Sang ; Tu, Yunhua ; Li, Song ; Song, Zhiwei

Author_Institution

Huawei Technol. Co., Ltd., Shenzhen, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

572

Lastpage

576

Abstract

Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mode, compare the performance of lead-free joints in four-point cyclic bend and accelerated temperature cycling(ATC), explore the application of four-point cyclic bend test method in lead-free solder joint reliability assessment.

Keywords

bending; product development; reliability; solders; LF solder joint reliability; accelerated temperature cycling; four-point cyclic bend test parameters; lead-free solder joint reliability assessment; product development; reliability assessment method; Assembly; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Life estimation; Life testing; Soldering; Temperature; US Department of Energy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270686

Filename

5270686