• DocumentCode
    3521243
  • Title

    Exploring MOL design options for a 20nm CMOS technology using TCAD

  • Author

    Scholze, Andreas ; Furkay, Stephen ; Kim, Seong-Dong ; Jain, Sameer

  • Author_Institution
    Semicond. R&D Center, IBM, Essex Junction, VT, USA
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    99
  • Lastpage
    102
  • Abstract
    A mixed-mode simulation framework is presented to study the AC performance of a 20nm bulk CMOS technology with respect to various options for contact design at the middle-of-line design level. These simulations combine the predictive capabilities of a calibrated two-dimensional TCAD model for a MOSFET with three-dimensional simulations for the layout dependent parasitic capacitances to extract the characteristic parameters of a multi-stage ring-oscillator circuit, such as the ring delay, and the effective switching capacitance. Significant performance degradation is predicted comparing the simulation results for a conventional contact design versus a typical 20nm design considering raised source-drain and a contact bar.
  • Keywords
    CMOS integrated circuits; MOSFET; calibration; oscillators; technology CAD (electronics); AC performance; MOL design level; MOSFET; bulk CMOS technology; layout dependent parasitic capacitance; middle-of-line design level; mixed-mode simulation framework; multi-stage ring-oscillator circuit; ring delay; size 20 nm; switching capacitance; three-dimensional simulation; two-dimensional TCAD model; Capacitance; Delay; Integrated circuit modeling; Inverters; Logic gates; MOSFET circuits; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035059
  • Filename
    6035059