• DocumentCode
    3521339
  • Title

    Density functional theory based simulation of carrier transport in silicon carbide and silicon carbide-silicon dioxide interfaces

  • Author

    Akturk, A. ; Salemi, S. ; Goldsman, N. ; Potbhare, S. ; Lelis, A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    119
  • Lastpage
    122
  • Abstract
    We present density functional theory based calculations of band structure and density of states curves for bulk silicon carbide (SiC) and possible silicon carbide-silicon dioxide (SiC-SiO2) interfaces. We then show carrier transport calculations in these structures using Monte Carlo techniques. This is for understanding the origins of the bandgap traps arising from the SiC-SiO2 interface, which are of relatively high concentration in SiC MOSFETs compared to those in Si MOSFETs. It is also for investigating the effects of different atomic configurations on channel mobility, on-resistance, and thus losses in SiC power MOSFETs that are used as low-loss switching devices in high power high temperature applications.
  • Keywords
    MOSFET; Monte Carlo methods; density functional theory; electronic density of states; energy gap; semiconductor-insulator boundaries; silicon compounds; wide band gap semiconductors; MOSFET; Monte Carlo techniques; SiC; SiC-SiO2; atomic configurations; band structure; bandgap traps; carrier transport; channel mobility; density functional theory; density of states; high-power high-temperature applications; low-loss switching devices; power losses; silicon carbide-silicon dioxide interfaces; Carbon; Discrete Fourier transforms; Monte Carlo methods; Photonic band gap; Scattering; Silicon; Silicon carbide; Monte Carlo transport; Silicon carbide; density of states; silicon carbide interface traps; silicon carbide-silicon dioxide interface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035064
  • Filename
    6035064