Nano resonator simulation fabrication and packaging consideration

Author

Zhang, Wei ; Liu, Zewen ; Wang, Zheng

Author_Institution

Inst. of Microelectron., Tsinghua Univ. Beijing, Beijing, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

508

Lastpage

511

Abstract

A study on simulation, fabrication and packaging of metallic nano resonator is presented. The nano resonator is modeled with an equivalent circuit and simulated using HSPICE. CMOS compatible process is used to fabricate the nano resonator with a minimum modification The suspended part of the device is released using HF vapor-phase etching. Packaging of nanoscale device is conceived based on the features, fabrication process and the application of the nano resonator.

Keywords

equivalent circuits; nanoelectromechanical devices; nanofabrication; resonators; semiconductor device packaging; sputter etching; CMOS compatible process; HF vapor-phase etching; HSPICE; equivalent circuit; metallic nano resonator simulation fabrication; nanofabrication process; nanoscale device packaging; Circuit simulation; Dielectric materials; Fabrication; Nanoelectromechanical systems; Nanoscale devices; Packaging; RLC circuits; Resonant frequency; Semiconductor materials; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270700

Filename

5270700