DocumentCode
3521409
Title
Diamond bit cutting for processing high topography wafers
Author
Agarwal, R. ; Pham, N. ; Cotrin, R. ; Andrei, A. ; Ruythooren, W. ; Iker, F. ; Soussan, P.
Author_Institution
IMEC, Leuven, Belgium
fYear
2009
fDate
9-11 Dec. 2009
Firstpage
267
Lastpage
271
Abstract
In this paper we report the results of diamond bit cutting on metals, such as Cu and Sn, polymers, temporary glue and polyimide. Diamond bit cutting is an attractive, fast and economically viable option when processing on high topography wafers is required, or when smooth surface finish is required. Diamond bit cutting can planarize the surface of the high topography features on which conventional IC processing steps can be performed with ease.
Keywords
cutting; diamond; wafer bonding; IC processing steps; diamond bit cutting; smooth surface finish; topography wafers; High speed optical techniques; Polyimides; Polymers; Rough surfaces; Stacking; Surface roughness; Surface topography; Temperature; Tin; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location
Singapore
Print_ISBN
978-1-4244-5099-2
Electronic_ISBN
978-1-4244-5100-5
Type
conf
DOI
10.1109/EPTC.2009.5416538
Filename
5416538
Link To Document