• DocumentCode
    3521461
  • Title

    The effect of leadframe finishing towards package delamination

  • Author

    Fong, Lim

  • Author_Institution
    Power Semicond. Dept., Infineon Technol. (Malaysia) Sdn Bhd, Batu Berendam, Malaysia
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    254
  • Lastpage
    259
  • Abstract
    Package reliability depends on the integrity of the interface between various materials. Key interfaces are between epoxy-based mold compound to leadframe and chip surfaces. In the present work, the adhesion of epoxy-based mold compound and copper leadframe with various finishing is being discussed. It is observed that dendrite like feature on the leadframe finishing is critical to prevent delamination between the molding compound to leadframe.
  • Keywords
    delamination; dendrites; solders; surface finishing; leadframe finishing; package delamination; package reliability; Capacitive sensors; Delamination; Environmentally friendly manufacturing techniques; Finishing; Lead; Microelectronics; Packaging; Temperature distribution; Temperature sensors; Tensile strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5099-2
  • Electronic_ISBN
    978-1-4244-5100-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416540
  • Filename
    5416540
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3521461