Title :
The effect of leadframe finishing towards package delamination
Author_Institution :
Power Semicond. Dept., Infineon Technol. (Malaysia) Sdn Bhd, Batu Berendam, Malaysia
Abstract :
Package reliability depends on the integrity of the interface between various materials. Key interfaces are between epoxy-based mold compound to leadframe and chip surfaces. In the present work, the adhesion of epoxy-based mold compound and copper leadframe with various finishing is being discussed. It is observed that dendrite like feature on the leadframe finishing is critical to prevent delamination between the molding compound to leadframe.
Keywords :
delamination; dendrites; solders; surface finishing; leadframe finishing; package delamination; package reliability; Capacitive sensors; Delamination; Environmentally friendly manufacturing techniques; Finishing; Lead; Microelectronics; Packaging; Temperature distribution; Temperature sensors; Tensile strain;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416540
